Innovation summit
December 8, 2025
Faculty of Engineering | Bar-Ilan University
Faculty of Engineering
Bar-Ilan University
Join us for the 2025 TSMC-BIU
Innovation Summit
The TSMC-BIU Innovation Summit brings together leaders from industry and academia to explore the latest breakthroughs shaping the future of semiconductor technology. Held at the Faculty of Engineering, Bar-Ilan University, this exclusive event will feature keynotes from TSMC and the EnICS Labs Institute, alongside invited talks from leading industrial partners and innovation updates from VCA, DCA, and EDA ecosystem partners. The Summit will highlight cutting-edge developments in advanced process technologies, design enablement, and AI-driven innovation. Participants will gain unique insights into the evolving semiconductor ecosystem, spanning topics such as advanced packaging, high-performance computing, and next-generation design automation. Join us to connect with global experts, discover new opportunities for collaboration, and be part of the dialogue driving the next era of semiconductor innovation.
Agenda of Bar-Ilan/TSMC Innovation Summit
Agenda of Bar-Ilan/TSMC
Innovation Summit
09:15-10:00
Registration and Breakfast
10:00-10:05
Welcome Remarks, Kohavit Baliti Levy, Israel Manager TSMC, EMEA
10:05-11:30 Track A: Keynotes and Invited Industrial Talks
10:05-10:30
Paul de Bot, President TSMC, EMEA
“Artificial Intelligence Fuels the Semiconductor Industry”
10:30-10:50
Alex Fish, Vice-dean of Industrial Relations, Co-director EnICS Labs Institute, BIU
“EnICS Labs: Academia to Impact”
10:50-11:10
Lior Khermosh, CTO, NeuReality
“From Silicon to System: Scaling AI Networking for the Next Era of Compute”
11:10-11:30
Amit Golander, VP Product & Engineering, Pliops
“The AI Feedback Loop: Designing Chips with AI, for AI Infrastructure”
11:30-12:00
Coffee Break and Academic Posters
12:00-14:10 Track B: VCA/DCA Partners
12:00-12:20
Pavel Vilk, GM, Head of Engineering, Avnet
“The Future of Semiconductor Integration”
12:20-12:40
Igor Elkanovich, CTO, GUC
“Advanced Packaging Technologies for Modular and Powerful Compute”
12:40-13:00
Freddy Gabay, Hebrew University
“AI at the Edge of Precision: Accelerating AI Efficiency with Approximate Computing”
13:00-14:10
Networking Lunch and Academic Posters
14:10-15:30 Track C: EDA Partners
14:10-14:30
Itamar Tsachi, European Manager, DFT, Siemens-EDA
“Advanced AI DFT technologies”
14:30-14:50
Shoshi Shamil, Sr AE manager, Cadence
“Harnessing Agentic AI for advanced Chip Design”
14:50-15:10
Asi Sapir, Synopsys
“Driving Pervasive Intelligence with AI-Driven EDA”
15:10-15:30
Special Program
15:30-16:30
Networking Happy Hour
Arrival and parking map
Parking is available in one of the external university parking lots of the university, highlighted on the map below.
Entrance to the “sport parking lot”, “Yehudit parking lot” and “Wohl parking lot“
is from “Max and Anna Webb” street,
which are a short walk from Gate 10 of the university.
The entrance to the “Music parking lot” is from Jabotinsky street (Givat Shmuel)
which is close to Gate 20 of the university.
Please make sure to get your ticket validated at the registration desk.
The conference will be held in the Faculty of Engineering, Building 1102.
If you have any trouble on the day of the event,
please call 03-5317236 or 054-9787143 for assistance.
Mark your calendars, Monday, December 8, 2025
The countdown has begun.
Fill out the registration form
Registration is closed. See you at the next conference.